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Cov khoom

High recycling Blasting Media txhua qhov ntau thiab tsawg ntsuab silicon carbide hmoov zoo gsic rau polishing thiab sib tsoo


  • Xim:Ntsuab
  • Cov ntsiab lus:> 98%
  • Basic Mineral:α-SiC
  • Crystal form:Hexagonal siv lead ua
  • Mohs hardness:3300kg / hli 3
  • Muaj tseeb ceev:3.2g / hli
  • Qhov ntau ntom ntom:1.2-1.6g / mm3
  • Specification gravity:3.20-3.25 dr hab
  • Product Detail

    APPLICATION

    Green Silicon Carbide Taw Qhia

    Ntsuab silicon carbide hmoov yog cov khoom zoo abrasive uas yog siv rau ntau yam kev siv xws li polishing thiab sandblasting.Nws yog lub npe hu rau nws zoo heev hardness, impressive txiav peev xwm, thiab superior zog.Ntsuab silicon carbide yog tsim los ntawm cua sov sib tov ntawm silica xuab zeb thiab cov pa roj carbon mus rau qhov kub thiab txias hauv qhov cub hluav taws xob.Qhov tshwm sim yog cov khoom siv crystalline nrog cov xim ntsuab zoo nkauj.

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    Green Silicon Carbide Lub Cev Khoom

     

    Lub cev muaj zog
    Crystal puab Hexagonal
    Qhov ntom ntom 1.55-1.20g / cm3
    Nplej ntom 3.90g / cm3
    Mohs Hardness 9.5 ib
    Knoop Hardness 3100-3400 Kg / hli 2
    Lub zog tawg 5800 kPa · cm-2
    Xim Ntsuab
    Melting point 2730ºC ua
    Thermal conductivity (6.28-9.63)W·m-1·K-1
    Linear expansion coefficient (4 - 4.5) * 10-6K-1 (0 - 1600 C)
    Loj Cov qoob loo faib Chemical Composition (%)
      D0 ≤ D3 ≤ D50 D94 ≥ SiC ≥ FC ≤ Fe 2O3 ≤
    #700 38 30 17 ± 0.5 12.5 ib 99.00 Nws 0.15 0.15
    #800 33 25 14 ± 0.4 9.8 ib 99.00 Nws 0.15 0.15
    #1000 28 20 11.5 ± 0.3 8.0 ib 98.50 ib 0.25 0.20 ib
    #1200 24 17 9.5 ± 0.3 6.0 98.50 ib 0.25 0.20 ib
    #1500 21 14 8.0 ± 0.3 5.0 98.00 Nws 0.35 Nws 0.30 Nws
    #2000 17 12 6.7 ± 0.3 4.5 98.00 Nws 0.35 Nws 0.30 Nws
    #2500 14 10 5.5 ± 0.3 3.5 97.70 ib 0.35 Nws 0.33 ib
    #3000 11 8 4.0 ± 0.3 2.5 97.70 ib 0.35 Nws 0.33 ib

     


  • Yav dhau los:
  • Tom ntej:

    1. Sib tsoo thiab txiav: precision sib tsoo ntawm cov hlau tawv, cov ntaub ntawv ceramic, thiab iav
    2. Sharpening thiab Honing: sharpening thiab honing tej cuab yeej xws li riam, chisels, thiab hniav
    3. Abrasive Blasting: kev npaj nto, tu, thiab etching daim ntaub ntawv
    4. Polishing thiab Lapping: precision polishing ntawm lo ntsiab muag, iav, thiab semiconductor wafer polishing
    5. Hlau Sawing: silicon wafers, gemstones, thiab ceramics
    6. Kev lag luam Refractory thiab Ceramic: kev tsim cov crucibles, kiln rooj tog, thiab lwm yam khoom kub-kub
    7. Kev lag luam semiconductor:
    8. Kev siv metallurgical

     

    Koj nug

    Yog tias koj muaj lus nug. Thov koj xav tiv tauj peb.

    daim ntawv nug
    Sau koj cov lus ntawm no thiab xa tuaj rau peb