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Nrov Abrasive Dawb Fused Alumina Dawb Txhuas Oxide Hmoov rau Polishing Blasting Lapping Sib Tsoo
- Yam khoom:Dawb hmoov
- Specification:0.7 hli - 2.0 hli
- Hardness:2100kg / hli 2
- Molecular Luj:102
- Melting Point:2010 ℃ -2050 ℃
- Boiling Point:2980 ℃
- Dej Soluble:Insoluble hauv dej
- Ceev:3.0-3.2g / cm3
- Cov ntsiab lus:99.7%
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Polishing thiab Sib Tsoo Micropowder Aluminium Oxide Hmoov rau Sintering Corundum thiab Ceramics
- Yam khoom:Dawb hmoov
- Specification:0.7 hli - 2.0 hli
- Hardness:2100kg / hli 2
- Molecular Luj:102
- Melting Point:2010 ℃ -2050 ℃
- Boiling Point:2980 ℃
- Dej Soluble:Insoluble hauv dej
- Ceev:3.0-3.2g / cm3
- Cov ntsiab lus:99.7%
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Tshuaj pleev ib ce qib Walnut Plhaub Fine hmoov rau ntsej muag, tawv nqaij, zaub mov Scrubs
- Fiber ntau:90.4%
- Roj:0.4%
- Dej:8.7%
- Hardness MOH:2.5-3.0 Nws
- Tshwj xeeb grivity:1.28
- PH:4-6
- Xim:lub teeb xim av
- Grain Shape:Pom granular lossis powdery nyob ntawm qib
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99.99% Purity Al2O3 Txhuas Oxide Hmoov
- Yam khoom:Dawb hmoov
- Specification:0.7 hli - 2.0 hli
- Hardness:2100kg / hli 2
- Molecular Luj:102
- Melting Point:2010 ℃ -2050 ℃
- Boiling Point:2980 ℃
- Dej Soluble:Insoluble hauv dej
- Ceev:3.0-3.2g / cm3
- Cov ntsiab lus:99.7%
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Aluminium Oxide Polishing Hmoov Rau Cellphone Screen
- Yam khoom:Dawb hmoov
- Specification:0.7 hli - 2.0 hli
- Hardness:2100kg / hli 2
- Molecular Luj:102
- Melting Point:2010 ℃ -2050 ℃
- Boiling Point:2980 ℃
- Dej Soluble:Insoluble hauv dej
- Ceev:3.0-3.2g / cm3
- Cov ntsiab lus:99.7%
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Polishing Abrasive Sib Tsoo Media Aluminium Oxide Polishing Hmoov Al2O3
- Yam khoom:Dawb hmoov
- Specification:0.7 hli - 2.0 hli
- Hardness:2100kg / hli 2
- Molecular Luj:102
- Melting Point:2010 ℃ -2050 ℃
- Boiling Point:2980 ℃
- Dej Soluble:Insoluble hauv dej
- Ceev:3.0-3.2g / cm3
- Cov ntsiab lus:99.7%