Pob zeb diamond micropowder yog ib hom ultrafine abrasive nrog tsis tshua muaj siab hardness thiab hnav tsis kam.Nws txoj kev siv yog qhov dav heev thiab tseem ceeb, feem ntau yog tshwm sim hauv cov hauv qab no:
1. Precisionsib tsoo thiab polishing: Pob zeb diamond hmoov tau dhau los ua cov khoom siv tsis tseem ceeb hauv kev ua tiav vim nws qhov hnyav hnyav thiab hnav tsis kam. Nyob rau hauv lub kho qhov muag, hluav taws xob, semiconductor thiab lwm yam lag luam, nws yog siv los polish optical lo ntsiab muag, silicon wafers, ceramic wafers thiab lwm yam high-precision cov ntaub ntawv, uas muaj peev xwm ua tau zoo heev nto tag thiab precision yuav tsum. Tsis tas li ntawd, nws kuj tau siv dav hauv kev sib tsoo ntawm cov ntaub ntawv nyuaj, xws li cemented carbide, ceramics, gemstones thiab lwm yam.
2. Pwm tsim thiab kho: Hauv kev lag luam pwm,pob zeb diamond micropowderyog siv rau precision ua thiab kho cov pwm. Los ntawm kev sib tsoo ultrafine ntawm cov hmoov micro, cov teeb meem me me ntawm cov pwm tuaj yeem kho tau, thiab qhov tseeb thiab kev pabcuam lub neej ntawm pwm tuaj yeem txhim kho. Lub caij no, pob zeb diamond micropowder tuaj yeem siv los tsim cov pwm pwm, xws li pwm cores.
3. Kev tsim cov cuab yeej txiav: pob zeb diamond hmoov yog ib qho tseem ceeb raw khoom rau kev tsim khoompob zeb diamond sib tsoo log, reamers, milling cutters thiab lwm yam cuab yeej txiav. Cov cuab yeej no muaj kev ua haujlwm siab heev thiab kev ua tau zoo hauv kev ua cov ntaub ntawv nyuaj, thiab tau siv dav hauv machining, zeb ua, kev tshawb nrhiav geological thiab lwm yam haujlwm.
Composite Material Enhancement:Pob zeb diamond micropowderkuj tseem tuaj yeem muab ntxiv rau cov ntaub ntawv sib xyaw ua cov khoom siv txhim kho los txhim kho hardness, hnav tsis kam thiab thermal stability ntawm cov ntaub ntawv sib xyaw. Mus saib lub vev xaib xov xwm kom paub ntxivtechnology xov xwm.
