Lub Luag Haujlwm ntawm Dawb Corundum Micropowder hauv Cov Khoom Siv Ntim Khoom Siv Hluav Taws Xob
Cov npoj yaig, cov neeg ua haujlwm hauv cov ntaub ntawv thiab kev ntim khoom paub tias thaum cov khoom siv hluav taws xob zoo li zoo kawg nkaus, nws yog txhua yam hais txog cov ntsiab lus. Nws zoo li muab ib lub tsho tiv thaiv rau ntawm ib lub chip muaj nqis. Lub tsho no yuav tsum tiv taus kev cuam tshuam (lub zog kho tshuab), tshem tawm cua sov (kev coj ua thermal), thiab muab kev rwb thaiv tsev thiab tiv taus dej noo. Qhov tsis zoo hauv ib qho ntawm cov no yog qhov tseem ceeb. Niaj hnub no, peb yuav tsom mus rau ib qho khoom siv uas siv ntau, tab sis nyuaj, - dawb corundum micropowder - los tshawb nrhiav seb cov khoom xyaw me me no ua lub luag haujlwm tseem ceeb hauv lub tsho tiv thaiv no li cas.
Ⅰ. Cia peb xub paub tus thawj coj tseem ceeb: tus "tub rog dawb" uas muaj kev dawb huv tshaj plaws.
Dawb corundum, hais yooj yim xwb, yog txhuas oxide (Al₂O₃) uas ntshiab heev. Nws muaj feem cuam tshuam nrog cov xim av corundum uas feem ntau pom, tab sis nws cov xeeb ntxwv yog ntshiab dua. Nws qhov kev ntshiab tshwj xeeb ua rau nws muaj xim dawb, muaj zog heev, tiv taus kub siab, thiab cov khoom siv tshuaj lom neeg ruaj khov heev, ua rau nws tsis cuam tshuam los ntawm lwm yam.
Kev sib tsoo nws mus rau hauv ib lub micron lossis txawm tias nanometer-scale hmoov zoo yog qhov peb hu uahmoov corundum dawbTsis txhob saib tsis taus cov hmoov no. Hauv cov ntaub ntawv ntim khoom siv hluav taws xob, tshwj xeeb tshaj yog cov tshuaj epoxy molding (EMC) lossis cov ntaub ntawv ntim khoom ceramic, nws tsis yog tsuas yog ib qho khoom ntxiv xwb; nws yog ib qho khoom siv ntxiv.
II. Nws ua dab tsi tiag tiag hauv lub ntim khoom?
Xav txog cov khoom ntim khoom zoo li ib daim ntawm "composite cement," nrog rau cov resin yog cov "kua nplaum" mos mos thiab nplaum uas tuav txhua yam ua ke. Tab sis kua nplaum ib leeg tsis txaus; nws mos dhau, tsis muaj zog, thiab tawg thaum cua sov. Qhov no yog qhov uas hmoov corundum dawb los rau hauv. Nws zoo li cov "pebbles" thiab "xuab zeb" ntxiv rau cov cement, ua rau kev ua tau zoo ntawm "cement" no nce mus rau qib tshiab.
Feem ntau: Zoo "kev xa cua sov"
Ib lub chip zoo li lub cub tawg me me. Yog tias cua sov tsis tuaj yeem ploj mus, nws tuaj yeem ua rau zaus tsis ua haujlwm thiab qeeb, lossis txawm tias hlawv tag nrho. Cov resin nws tus kheej yog tus coj cua sov tsis zoo, ntes cua sov sab hauv - qhov xwm txheej tsis xis nyob tiag tiag.
Dawb corundum micropowdermuaj cov thermal conductivity siab dua li cov resin. Thaum muaj ntau cov micropowder sib npaug zos hauv cov resin, nws tsim tau ib lub network ntawm ntau qhov me me "thermal highways." Cov cua sov tsim los ntawm cov chip tau coj los ntawm sab hauv mus rau saum npoo ntawm pob khoom los ntawm cov khoom dawb corundum no, thiab tom qab ntawd dissipated mus rau hauv huab cua lossis lub dab dej cua sov. Cov hmoov ntxiv ntau dua thiab qhov sib phim zoo tshaj plaws ntawm qhov loj me ntawm cov khoom, qhov denser thiab ntau dua kua no thermal network ua, thiab qhov siab dua tag nrho cov thermal conductivity (TC) ntawm cov khoom ntim khoom. Cov khoom siv high-end tam sim no tab tom siv zog rau cov thermal conductivity siab, thiab cov hmoov dawb corundum micropowder ua lub luag haujlwm tseem ceeb hauv qhov no.
Kev Txawj Tshwj Xeeb: Kev Tswj Xyuas Kev Nthuav Dav Thermal
Qhov no yog ib txoj haujlwm tseem ceeb heev! Lub chip (feem ntau yog silicon), cov khoom ntim khoom, thiab cov substrate (xws li PCB) txhua tus muaj cov coefficients ntawm thermal expansion (CTE) sib txawv. Hais yooj yim, thaum cua sov, lawv nthuav dav thiab cog lus rau ntau qib. Yog tias qhov nce thiab nqis ntawm cov khoom ntim khoom sib txawv ntawm cov chip, qhov kub thiab txias hloov pauv, qhov kub thiab txias thiab kub hloov pauv, yuav tsim kev ntxhov siab sab hauv. Qhov no zoo li ntau tus neeg rub ib daim khaub ncaws mus rau ntau qhov kev taw qhia. Raws sijhawm, qhov no tuaj yeem ua rau lub chip tawg lossis solder cov pob qij txha ua tsis tiav. Qhov no hu ua "thermomechanical failure."
Hmoov dawb corundum muaj qhov coefficient ntawm kev nthuav dav thermal qis heev thiab ruaj khov heev. Ntxiv nws rau hauv cov resin ua rau qhov coefficient ntawm kev nthuav dav thermal ntawm tag nrho cov khoom sib xyaw, sib phim zoo nrog cov silicon chip thiab substrate. Qhov no ua kom ntseeg tau tias cov ntaub ntawv nthuav dav thiab cog lus ua ke thaum muaj kev hloov pauv kub, txo qis kev ntxhov siab sab hauv thiab txhim kho kev ntseeg siab thiab lub neej ntawm cov khoom siv. Qhov no zoo li ib pab pawg: tsuas yog thaum lawv ua haujlwm ua ke lawv thiaj li ua tiav qee yam.
Cov Txuj Ci Tseem Ceeb: Ib qho "Ua Kom Pob Txha Muaj Zog" Muaj Zog
Tom qab kho, cov roj hmab ntshiab muaj lub zog nruab nrab, qhov nyuaj, thiab kev tiv thaiv kev hnav. Ntxiv cov hmoov corundum dawb uas muaj zog thiab muaj zog zoo li muab ntau txhiab lab "pob txha" tawv tso rau hauv cov roj hmab mos. Qhov no coj peb qhov txiaj ntsig tseem ceeb:
Modulus ntxiv: Cov khoom siv yog ntau dua thiab tsawg dua rau deformation, zoo dua tiv thaiv sab hauv nti thiab kub xov hlau.
Lub zog ntxiv: Lub zog flexural thiab compressive tau nce ntxiv, uas ua rau nws tiv taus kev poob siab thiab kev ntxhov siab sab nraud.
Kev tiv taus kev txhuam thiab dej noo: Qhov saum npoo ntawm pob khoom tawv dua thiab tiv taus kev hnav ntau dua. Tsis tas li ntawd, qhov kev sau ntom ntom txo txoj kev nkag mus rau hauv dej noo, txhim kho kev tiv taus dej noo.
III. Tsuas yog ntxiv rau hauv xwb? Kev tswj xyuas zoo yog qhov tseem ceeb!
Tam sim no, tej zaum koj yuav xav tias nws yooj yim heev - tsuas yog ntxiv hmoov ntau li ntau tau rau hauv cov roj hmab. Zoo, qhov no yog qhov kev txawj ntse tiag tiag nyob. Hom hmoov uas yuav ntxiv thiab yuav ua li cas ntxiv nws yog qhov nyuaj heev.
Qhov huv yog qhov tseem ceeb: Qib hluav taws xob thiab qib abrasive yog ob yam sib txawv. Tshwj xeeb, cov ntsiab lus ntawm cov hlau tsis huv xws li potassium (K) thiab sodium (Na) yuav tsum tau tswj kom qis heev ppm. Cov tsis huv no tuaj yeem tsiv mus rau hauv cov teb hluav taws xob thiab cov chaw noo noo, ua rau muaj kev xau hluav taws xob lossis txawm tias luv luv circuits, uas yog qhov txaus ntshai rau kev ntseeg siab. "Dawb" tsis yog xim xwb; nws yog lub cim ntawm kev huv. Qhov loj me ntawm cov khoom me me thiab kev ntsuas qib yog ib daim duab kos duab: Xav txog yog tias txhua lub pob zeb yog tib qhov loj me, yuav muaj qhov sib txawv ntawm lawv. Peb yuav tsum "qib" cov hmoov me me ntawm ntau qhov ntau thiab tsawg kom cov pob zeb me me puv qhov sib txawv ntawm cov pob zeb loj dua, ua tiav qhov ntim siab tshaj plaws. Qhov ntim siab dua muab cov txheej txheem thermal conductivity ntau dua thiab tswj tau zoo dua ntawm cov coefficient nthuav dav thermal. Tib lub sijhawm, qhov loj me ntawm cov khoom me me yuav tsum tsis txhob ntxhib dhau, uas yuav cuam tshuam rau kev ua haujlwm fluidity thiab qhov tiav ntawm qhov chaw; tsis txhob zoo dhau, vim qhov no yuav tsim thaj chaw loj thiab tso cai rau kev nqus cov resin ntau dhau, txo qhov nrawm ntawm kev sau thiab nce tus nqi. Kev tsim cov khoom me me no yog ib qho ntawm cov lus zais tseem ceeb ntawm txhua daim ntawv.
Kev kho qhov chaw thiab kev kho qhov chaw yog qhov tseem ceeb heev: Cov duab ntawm cov khoom yuav tsum zoo li qub, sib npaug zos, nrog tsawg dua cov ces kaum ntse. Qhov no ua kom muaj kev ntws zoo hauv cov resin thiab txo qhov kev ntxhov siab. Kev kho qhov chaw tseem ceeb dua.Dawb corundumyog hydrophilic, thaum cov resin yog hydrophobic, ua rau lawv tsis sib xws. Yog li ntawd, qhov chaw micropowder yuav tsum tau coated nrog ib tug silane coupling agent, muab nws ib tug "organic txheej." Ua li no, cov hmoov yuav tsum tau sib xyaw nrog cov resin, zam qhov interface ua ib qho tsis muaj zog uas ua rau tawg thaum raug rau dej noo lossis kev ntxhov siab.